Optimization of the thermoelectric performance of layer-by-layer structured copper-phthalocyanine (CuPc) thin films doped with hexacyano-trimethylene-cyclopropane (CN6-CP)

Optical Properties of Copper Phthalocyanine(CuPc)Thin Films

Layer-by-layer epitaxial thin films of the pyrochlore Tb2Ti2O7.

Layer-by-layer epitaxial growth of the pyrochlore magnet Tb2Ti2O7 on the isostructural substrate Y2Ti2O7 results in high-quality single crystal films of up to 60 nm thickness. Substrate-induced strain is shown to act as a strong and controlled perturbation to the exotic magnetism of Tb2Ti2O7, opening up the general prospect of strain-engineering the diverse magnetic and electrical properties of...

Mechanical Properties and Microstructural Evolution of Ta/TaNx Double Layer Thin Films Deposited by Magnetron Sputtering

Crystalline tantalum thin films of about 500nm thickness were deposited on AISI 316L stainless steel substrate using magnetron sputtering. To investigate the nano-mechanical properties of tantalum films, deposition was performed at two temperatures (25°C and 200°C) on TaNx intermediate layer with different N2/Ar flow rate ratio from 0 to 30%. Nano-indentation was performed to obtain the mechani...

Thin, Continuous, and Conformal Copper Films by Reduction of Atomic Layer Deposited Copper Nitride

Thin and continuous copper films serve as seed layers for electrodeposition of interconnects in microelectronic devices. Gaps in the continuity of these Cu films must be avoided, because they can generate voids that later lead to failure of the devices. It is difficult to sputter completely continuous copper-seed layers into the increasingly narrow trenches and holes in modern interconnects. He...

Optimization of Sensitivity and Stability of Gold/Silver bi-Layer Thin Films Used in Surface Plasmon Resonance Chips

The aim of this study is experimental assay of sensitivity and stability of a bimetallic silver/gold SPR sensor chip. This chip utilizes the sensitivity of the silver and the stability of the gold. Moreover, the Silver layer (instead of usual Cr or Ti layer) was used as an adhesive intermediate layer between the Gold layer and the glass substrate. The optimization of the Gold/Silver thickness u...